Chip Quik Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (35g syringe)


Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Sn/Pb in 35g/10cc syringe with plunger and tips.

Revolutionary Formula: No Refrigeration Required!

Alloy: Sn63/Pb37

Flux Type: Synthetic No-Clean

Flux Classification: REL0

Metal Content: 88% metal by weight.

Particle Size: T4 (20-38 microns)

Melting Point: 183C (361F)

Size: 35g/10cc syringe

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: